Amkor Technology, Inc.

Amkor provides package solutions such as Package on Package (PoP), Stacked Packaging, Flip Chip, MicroLeadFrame, System-in-Package, MEMS, and Wafer Level Packaging (WLP), for latest generation applications, including digital cameras, cell phones, network servers, laptops, video games, semiconductors and MP3 players, among others. The company also provides a complete range of test engineering services for RF, mixed signal, logic and memory devices, from test program development to full product characterization.