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Amkor provides package solutions such as Package on Package (PoP), Stacked Packaging, Flip Chip, MicroLeadFrame, System-in-Package, MEMS, and Wafer Level Packaging (WLP), for latest generation applications, including digital cameras, cell phones, network servers, laptops, video games, semiconductors and MP3 players, among others. The company also provides a complete range of test engineering services for RF, mixed signal, logic and memory devices, from test program development to full product characterization.
Basic corporate social responsibility ratingsData sources for this companyRatings history Subcategory CSR ratings
| | Employees | Environment |
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| Compensation & Benefits | Diversity & Labor Rights | Training, Health & Safety | Energy & Climate Change | Policy & Reporting | Resource Management |
| Amkor Technology, Inc. | | | | | | |
| Semiconductor & Other Electronic Component Mfg. | | | | | | |
| CSRHub Average | 43 | 47 | 47 | 44 | 46 | 46 |
| USA | | | | | | |
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