ESG News For Taiwan Semiconductor Manufacturing Company Ltd.

Highlights:AI-driven digital and custom design flows available for the latest TSMC N2P and N3 technologiesCadence is collaborating with TSMC on A16 design solutions to optimize PPACadence Integrity 3D-IC Platform unifying packaging, analog and digital design supports latest 3Dblox featuresCollaboration includes Celsius Studio mechanical analysis enablement and thermal/voltage impacts on power/IR/STA and what-if in-design analysisDesign IP powers the AI factory, including the industry’s first silicon-proven GDDR7 IP running at 32Gbps on the TSMC N3 technologyCadence solutions support secure chip design in the cloud, with design solutions to support TSMC silicon photonics technologies

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